International Patent: CHIP, ULTRASONIC FINGERPRINT MODULE, AND ELECTRONIC DEVICE

GENEVA, Aug. 31 -- SHENZHEN GOODIX TECHNOLOGY CO., LTD. filed a patent application (CN2025/121260) for “CHIP, ULTRASONIC FINGERPRINT MODULE, AND ELECTRONIC DEVICE”. With publication no. WO/2026/174774, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G06V 40/13

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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