GENEVA, May 3 -- CHINALCO MATERIALS APPLICATION RESEARCH INSTITUTE CO., LTD (Future Science ParkChangping District, Beijing 102209), 中铝材料应用研究院有限公司 (中国北京市昌平区未来科学城南区) filed a patent application (PCT/CN2025/121662) for "COOLING RATE-BASED CASTING PROCESS SOLIDIFICATION SIMULATION METHOD" on Sep 16, 2025. With publication no. WO/2026/086496, the details related to the patent application was published on Apr 30, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World ...