GENEVA, July 31 -- RESCOM TECHNOLOGIES PRIVATE LIMITED filed a patent application (IN2026/050128) for “BUNDLING MACHINE WITH INTEGRATED HUB”. With publication no. WO/2026/159751, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B65B 13/28
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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