International Patent: BUFFER CHIP FOR ROUTING COMMAND/ADDRESS AND DATA SIGNALS TO A STACK OF MEMORY DIES WITHIN A MEMORY SYSTEM

GENEVA, July 9 -- MICRON TECHNOLOGY, INC. filed a patent application (US2025/061431) for “BUFFER CHIP FOR ROUTING COMMAND/ADDRESS AND DATA SIGNALS TO A STACK OF MEMORY DIES WITHIN A MEMORY SYSTEM”. With publication no. WO/2026/147869, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G06F 3/06

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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