GENEVA, Aug. 31 -- ORIGIN COMPANY, LIMITED filed a patent application (JP2026/005187) for “BONDING DEVICE AND METHOD FOR MANUFACTURING BONDED COMPONENT”. With publication no. WO/2026/177059, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B29C 65/48
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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