International Patent: BONDING A FOAM, SENSOR OR FUNCTIONAL PART INSIDE A TIRE WITH A PRESSURE SENSITIVE HOTMELT ADHESIVE

GENEVA, June 24 -- HENKEL AG & CO. KGAA filed a patent application (EP2025/081509) for “BONDING A FOAM, SENSOR OR FUNCTIONAL PART INSIDE A TIRE WITH A PRESSURE SENSITIVE HOTMELT ADHESIVE”. With publication no. WO/2026/114602, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C09J 5/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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