International Patent: BONDED ASSEMBLIES INCLUDING THROUGH-DIE VIA STRUCTURES AND METHODS FOR FORMING THE SAME

GENEVA, Sept. 18 -- SANDISK TECHNOLOGIES, INC. filed a patent application (US2025/035218) for “BONDED ASSEMBLIES INCLUDING THROUGH-DIE VIA STRUCTURES AND METHODS FOR FORMING THE SAME”. With publication no. WO/2026/187377, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10B 80/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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