GENEVA, July 2 -- TONGFU MICROELECTRONICS CO., LTD. filed a patent application (CN2025/139753) for “BOARD-LEVEL PACKAGING STRUCTURE, PACKAGING METHOD, AND PACKAGING SYSTEM”. With publication no. WO/2026/130112, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 70/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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