GENEVA, July 31 -- QUALCOMM INCORPORATED filed a patent application (US2025/058468) for “BLOCK-BASED THREE-DIMENSIONAL (3D) RECONSTRUCTION SYSTEM WITH MESH HYSTERESIS AND SIMPLIFICATION”. With publication no. WO/2026/161162, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G06T 17/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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