GENEVA, April 19 -- BESTBON CO., LTD. (506, Individual Startup Incubation Room 48, Buldang 14-ro,Seobuk-gu, Cheonan-si,Chungcheongnam-do 31169), 베스트본 주식회사 (충청남도천안시 서북구불당14로 48, 개별보육실 506호) filed a patent application (PCT/KR2025/011769) for "HYBRID DIE BONDING APPARATUS AND HYBRID DIE BONDING METHOD" on Aug 06, 2025. With publication no. WO/2026/079616, the details related to the patent application was published on Apr 16, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by th...