GENEVA, March 9 -- BEIJING KMT TECHNOLOGY CO., LTD. (First Floor, Building 7, No.9 Yongteng North RoadHaidian District, Beijing 100094), 北京康美特科技股份有限公司 (中国北京市海淀区永腾北路9号院7号楼1层) filed a patent application (PCT/CN2025/118284) for "THERMALLY CONDUCTIVE SILICONE RUBBER AND PREPARATION METHOD THEREFOR" on Sep 01, 2025. With publication no. WO/2026/046401, the details related to the patent application was published on Mar 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which ...