INTERNATIONAL PATENT: BEIJING IC-EAST SEMICONDUCTOR TECHNOLOGY CO., LTD, 北京芯东来半导体科技有限公司 FILES APPLICATION FOR "HIGH-PRECISION LEVELING APPARATUS, LEVELING PLATFORM AND LEVELING METHOD"

Posted On: 2026-03-23

GENEVA, March 23 -- BEIJING IC-EAST SEMICONDUCTOR TECHNOLOGY CO., LTD (Room 210-1, 2nd Floor, Building 56, No. 21 Beihongluo East Road, Dazhong Fule VillageHuairou District, Beijing 101400), 北京芯东来半导体科技有限公司 (中国北京市怀柔区大中富乐村北红螺东路21号56幢2层210-1室) filed a patent application (PCT/CN2025/121055) for "HIGH-PRECISION LEVELING APPARATUS, LEVELING PLATFORM, AND LEVELING METHOD" on Sep 12, 2025. With publication no. WO/2026/057045, the details related to the patent application was published on Mar 19, 2026....

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इस लेख के रीप्रिंट को खरीदने या इस प्रकाशन का पूरा फ़ीड प्राप्त करने के लिए, कृपया हमे संपर्क करें.

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INTERNATIONAL PATENT: BEIJING IC-EAST SEMICONDUCTOR TECHNOLOGY CO., LTD, 北京芯东来半导体科技有限公司 FILES APPLICATION FOR "HIGH-PRECISION LEVELING APPARATUS, LEVELING PLATFORM AND LEVELING METHOD"