International Patent: BEARING DEVICE FOR GRINDING APPARATUS, GRINDING APPARATUS, GRINDING METHOD, AND SILICON WAFER

GENEVA, June 24 -- XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD. filed a patent application (CN2025/135702) for “BEARING DEVICE FOR GRINDING APPARATUS, GRINDING APPARATUS, GRINDING METHOD, AND SILICON WAFER”. With publication no. WO/2026/114020, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B24B 37/30

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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