GENEVA, May 5 -- BANDAI CO., LTD. (4-8, Komagata 1-chome, Taito-ku, Tokyo1118081), 株式会社バンダイ (東京都台東区駒形一丁目４番８号) filed a patent application (PCT/JP2025/037067) for "MODEL TOY AND MODEL COMPONENT" on Oct 22, 2025. With publication no. WO/2026/088967, the details related to the patent application was published on Apr 30, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): ISHIKAWA Yasuhiro (c/o BANDAI SPIRITS CO., LTD., Sumitomo Fudosan Tokyo...