INTERNATIONAL PATENT: AUTOMOTIVE CHIP TECHNOLOGY RESEARCH INSTITUTE, 苏州思萃车规半导体产业技术研究所有限公司 FILES APPLICATION FOR "SEMICONDUCTOR WAFER LEVEL PACKAGE METHOD AND PACKAGE STRUCTURE"

GENEVA, March 2 -- AUTOMOTIVE CHIP TECHNOLOGY RESEARCH INSTITUTE (No.133 Changyang Street, Suzhou Industrial ParkSuzhou, Jiangsu 215126), 苏州思萃车规半导体产业技术研究所有限公司 (中国江苏省苏州市苏州工业园区长阳街133号) filed a patent application (PCT/CN2025/116037) for "SEMICONDUCTOR WAFER LEVEL PACKAGE METHOD AND PACKAGE STRUCTURE" on Aug 21, 2025. With publication no. WO/2026/041074, the details related to the patent application was published on Feb 26, 2026.

Notably, the patent application was submitted under t...