GENEVA, Sept. 18 -- OS CO.,LTD filed a patent application (KR2025/011655) for “ATOMIC LAYER ETCHING APPARATUS USING HIGH-SPEED HEAT SOURCE”. With publication no. WO/2026/186970, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01J 37/32
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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