International Patent: ASSEMBLY OF A PRINTED CIRCUIT BOARD AND AN ELECTRICALLY AND/OR THERMALLY CONDUCTIVE COMPONENT AND METHOD FOR MANUFACTURING SAID ASSEMBLY

GENEVA, Aug. 31 -- RENAULT S.A.S. filed a patent application (EP2026/050223) for “ASSEMBLY OF A PRINTED CIRCUIT BOARD AND AN ELECTRICALLY AND/OR THERMALLY CONDUCTIVE COMPONENT AND METHOD FOR MANUFACTURING SAID ASSEMBLY”. With publication no. WO/2026/175560, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H05K 1/11

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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