International Patent: ASSEMBLY OF A METAL DISCOID HONEYCOMB STRUCTURE AND A SUPPORT STRUCTURE AND USE OF SAID ASSEMBLY, GAS HEATER AND PRODUCTION OF SAID GAS HEATER

GENEVA, Aug. 7 -- EMITEC TECHNOLOGIES GMBH filed a patent application (EP2026/052516) for “ASSEMBLY OF A METAL DISCOID HONEYCOMB STRUCTURE AND A SUPPORT STRUCTURE AND USE OF SAID ASSEMBLY, GAS HEATER AND PRODUCTION OF SAID GAS HEATER”. With publication no. WO/2026/162762, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: F01N 3/20

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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