GENEVA, March 24 -- ASM AMERICA, INC. (3440 East University DrivePhoenix, AZ 85034) filed a patent application (PCT/US2025/045607) for "THERMALLY CONDUCTIVE CHEMICAL MECHANICAL POLISHING (CMP) PAD" on Sep 09, 2025. With publication no. WO/2026/059925, the details related to the patent application was published on Mar 19, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SHUGRUE, John Kevin (c/o Asm America, Inc.3440 East University DrivePhoenix, AZ 85034)
Abstract: Thermally conductive chemical mechanical polishing (CMP) pads are disclosed. In one aspect, a polishing pad for a CMP system incl...