INTERNATIONAL PATENT: ASAHI KASEI KABUSHIKI KAISHA, 旭化成株式会社 FILES APPLICATION FOR "EPOXY RESIN COMPOSITION, CURED OBJECT, UNDERFILL MATERIAL, ADHESIVE AND SEMICONDUCTOR PACKAGE AND PRODUCTION METHOD THEREFOR"

GENEVA, May 19 -- ASAHI KASEI KABUSHIKI KAISHA (1-1-2 Yurakucho, Chiyoda-ku, Tokyo1000006), 旭化成株式会社 (東京都千代田区有楽町一丁目１番２号) filed a patent application (PCT/JP2025/038439) for "EPOXY RESIN COMPOSITION, CURED OBJECT, UNDERFILL MATERIAL, ADHESIVE, AND SEMICONDUCTOR PACKAGE AND PRODUCTION METHOD THEREFOR" on Oct 31, 2025. With publication no. WO/2026/100491, the details related to the patent application was published on May 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Pr...