International Patent: ARRAY SUBSTRATE, CHIP ON FILM, DISPLAY PANEL AND APPARATUS, AND RESISTANCE TEST METHOD

GENEVA, June 24 -- BOE TECHNOLOGY GROUP CO., LTD. filed a patent application (CN2024/135388) for “ARRAY SUBSTRATE, CHIP ON FILM, DISPLAY PANEL AND APPARATUS, AND RESISTANCE TEST METHOD”. With publication no. WO/2026/112912, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10D 86/60

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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