INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "WIDE-BANDGAP SUPER JUNCTION STRUCTURES FOR POWER DEVICES"

GENEVA, March 11 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/042723) for "WIDE-BANDGAP SUPER JUNCTION STRUCTURES FOR POWER DEVICES" on Aug 20, 2025. With publication no. WO/2026/050058, the details related to the patent application was published on Mar 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NOURBAKHSH, Amirhasan (3050 Bowers AvenueSanta Clara, California 95054)

Abstract: A super junction device may be formed by decreasing the width of the P-type region and increasing the doping concentration, allowing for a...