INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "WAFER SIMULATION PLATE"

GENEVA, March 3 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2024/043683) for "WAFER SIMULATION PLATE" on Aug 23, 2024. With publication no. WO/2026/043500, the details related to the patent application was published on Feb 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KASSAM PIRBHAI, Aliya (c/o Applied Materials, Inc.Law Dept., M/S 12693050 Bowers AvenueSanta Clara, California 95054)

Abstract: Embodiments of the disclosure describe an apparatus for simulating a wafer during processing. The apparatus includes a plate ha...