INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "WAFER BONDING PROCESS"

GENEVA, March 31 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, CA 95054) filed a patent application (PCT/US2025/040972) for "WAFER BONDING PROCESS" on Aug 06, 2025. With publication no. WO/2026/064023, the details related to the patent application was published on Mar 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YIEH, Ellie (5888 Pistoia WaySan Jose, CA 95138), BEKIARIS, Nikolaos (130 Graham DriveCampbell, CA 95008), XUE, Lei (3050 Bowers AvenueSanta Clara, CA 95054), MA, Kai (370 Edlee AvenuePalo Alto, CA 94306)

Abstract: Embodiments described herein relate to an appara...