INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "VIA AND REDISTRIBUTION LAYER FORMATION PROCESS FOR GLASS INTERPOSER"

GENEVA, April 8 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/048463) for "VIA AND REDISTRIBUTION LAYER FORMATION PROCESS FOR GLASS INTERPOSER" on Sep 29, 2025. With publication no. WO/2026/073117, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WOZNY, Sarah (9700 US HWY 290 EastAustin, Texas 78724), BERNT, Marvin Louis (Applied Materials PPC655 West Reserve Dr.Kalispell, Montana 59901)

Abstract: Methods and apparatus for processing a substrate are pro...