INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "PHOTONIC INTERCONNECTS TO ENABLE COMMUNICATION BETWEEN PROCESSOR COMPONENTS AND MEMORY COMPONENTS"

GENEVA, March 31 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/047244) for "PHOTONIC INTERCONNECTS TO ENABLE COMMUNICATION BETWEEN PROCESSOR COMPONENTS AND MEMORY COMPONENTS" on Sep 19, 2025. With publication no. WO/2026/064670, the details related to the patent application was published on Mar 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BHANSALI, Ameet S. (3050 Bowers AvenueSanta Clara, California 95054), NALAMASU, Omkaram (3050 Bowers AvenueSanta Clara, California 95054), PATIBANDLA, Nag B. (3050 Bowers AvenueSan...