INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "METHOD FOR FORMING THROUGH VIAS IN A DIE STACK"

GENEVA, May 12 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/048838) for "METHOD FOR FORMING THROUGH VIAS IN A DIE STACK" on Sep 30, 2025. With publication no. WO/2026/096139, the details related to the patent application was published on May 07, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): VARGHESE, Sony (3050 Bowers AvenueSanta Clara, California 95054), KHASGIWALE, Niranjan R. (3050 Bowers AvenueSanta Clara, California 95054)

Abstract: A method includes forming a plurality of dies on one or more first substrates. The...