INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "CHIP-ON-GLASS ARCHITECTURE FOR THERMAL DISSIPATION"

GENEVA, April 20 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/049608) for "CHIP-ON-GLASS ARCHITECTURE FOR THERMAL DISSIPATION" on Oct 06, 2025. With publication no. WO/2026/080361, the details related to the patent application was published on Apr 16, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): FRANSIS, Bert (3050 Bowers AvenueSanta Clara, California 95054)

Abstract: A glass substrate architecture for mounting RF components may be configured for heat dissipation. Existing millimeter wave radiofrequency (RF) systems m...