INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "BONDING LAYER WITH METALLIZATION FEATURES"

GENEVA, March 3 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/042402) for "BONDING LAYER WITH METALLIZATION FEATURES" on Aug 18, 2025. With publication no. WO/2026/043795, the details related to the patent application was published on Feb 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): JEON, Yoocharn (3333 Scott Blvd.Santa Clara, California 95054)

Abstract: Methods and structures relating to bonding wafers using an aluminum nitride bonding layer with embedded metallization features. In some embodiments, the method may...