INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "BONDED DEVICE HAVING SPLIT BONDING LAYER AND METHODS OF FORMATION"

GENEVA, March 24 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/043427) for "BONDED DEVICE HAVING SPLIT BONDING LAYER AND METHODS OF FORMATION" on Aug 26, 2025. With publication no. WO/2026/059725, the details related to the patent application was published on Mar 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KRISHNAN, Siddarth (3050 Bowers AvenueSanta Clara, California 95054), CHUDZIK, Michael Patrick (3050 Bowers AvenueSanta Clara, California 95054)

Abstract: A method of forming a bonded device. The method may incl...