GENEVA, June 19 -- WUS PRINTED CIRCUIT KEPZ (KUNSHAN) CO., LTD. filed a patent application (CN2025/134241) for “APPLICATION METHOD OF COMPONENT-EMBEDDED PACKAGING UNIT IN PCB”. With publication no. WO/2026/103713, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H05K 3/30
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....