International Patent: APPARATUS AND METHOD FOR PREDICTING WAFER ABNORMALITY IN REAL TIME ON BASIS OF PRE-TRAINED ARTIFICIAL INTELLIGENCE MODEL

GENEVA, Oct. 30 -- HEX A.I. LABS INC. filed a patent application (KR2025/019564) for “APPARATUS AND METHOD FOR PREDICTING WAFER ABNORMALITY IN REAL TIME ON BASIS OF PRE-TRAINED ARTIFICIAL INTELLIGENCE MODEL”. With publication no. WO/2026/225702, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 74/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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