GENEVA, June 26 -- TENOVA S.P.A. filed a patent application (IB2025/062255) for “APPARATUS, SYSTEM AND METHOD FOR REDUCING FOAM IN A FOAMY METALLURGICAL SLAG”. With publication no. WO/2026/120441, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C21B 3/06
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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