GENEVA, March 9 -- ALPHA ASSEMBLY SOLUTIONS INC. (245 Freight StreetWaterbury, Connecticut 06702), SETNA, ROHAN, P. (c/o Boult Wade Tennant LLPSalisbury Square House8 Salisbury SquareLondon EC4Y 8AP) filed a patent application (PCT/EP2025/073854) for "DUAL-CURING ADHESIVE" on Aug 21, 2025. With publication no. WO/2026/046820, the details related to the patent application was published on Mar 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): LEE, Eun Jung (c/o Alpha Assembly Solutions Inc., 245 Freight StreetWaterbury, Connecticut 06702), KIM, Dong Hyun (c/o Alpha Assembly Solutions Inc., 2...