International Patent: ADVANCED PACKAGING AND THERMAL SOLUTION DESIGNS FOR HIGH CURRENT DENSITY INTEGRATED CIRCUITS

GENEVA, July 6 -- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. filed a patent application (US2025/059664) for “ADVANCED PACKAGING AND THERMAL SOLUTION DESIGNS FOR HIGH CURRENT DENSITY INTEGRATED CIRCUITS”. With publication no. WO/2026/142877, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 40/20

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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