INTERNATIONAL PATENT: ADVANCED MICRO DEVICES, INC. FILES APPLICATION FOR "CHIP PACKAGE WITH MULTI-TIER STACKS"

GENEVA, April 8 -- ADVANCED MICRO DEVICES, INC. (2485 Augustine DriveSanta Clara, California 95054) filed a patent application (PCT/US2025/042673) for "CHIP PACKAGE WITH MULTI-TIER STACKS" on Aug 19, 2025. With publication no. WO/2026/072194, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KULKARNI, Deepak Vasant (7171 Southwest PkwyAustin, Texas 78735), NAFFZIGER, Samuel (2950 East Harmony Road, Suite 300Fort Collins, Colorado 80528)

Abstract: Disclosed herein are chip packages and methods for fabricating and operating ...