GENEVA, June 19 -- SEKISUI CHEMICAL CO., LTD. filed a patent application (JP2025/039866) for “ADHESIVE TAPE FOR SEMICONDUCTOR MANUFACTURING PROCESS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP”. With publication no. WO/2026/105828, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/50
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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