International Patent: ADHESIVE FILM, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE

GENEVA, June 24 -- RESONAC CORPORATION filed a patent application (JP2025/040811) for “ADHESIVE FILM, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE”. With publication no. WO/2026/116263, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C09J 7/35

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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