GENEVA, July 18 -- DDP SPECIALTY ELECTRONIC MATERIALS US, LLC filed a patent application (US2026/010224) for “ADHESIVE COMPOSITION WITH ANTI-CORROSION AND LOW BAKING SHRINKAGE PROPERTIES”. With publication no. WO/2026/151668, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C09J 163/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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