GENEVA, Aug. 21 -- COVESTRO DEUTSCHLAND AG filed a patent application (EP2026/052777) for “ADHESIVE BONDS WITH INCREASED TEMPERATURE RESISTANCE BY MEANS OF CROSS-LINKED THERMOPLASTIC POLYURETHANES”. With publication no. WO/2026/171551, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08G 18/79
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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