International Patent: ADD-ON MODULE ENABLING COST EFFECTIVE AND COMPACT SOLUTION FOR INSPECTING LARGE INTEGRATED CIRCUIT COMPONENT

GENEVA, Aug. 14 -- KLA CORPORATION filed a patent application (US2026/012611) for “ADD-ON MODULE ENABLING COST EFFECTIVE AND COMPACT SOLUTION FOR INSPECTING LARGE INTEGRATED CIRCUIT COMPONENT”. With publication no. WO/2026/169464, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B65G 47/91

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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