International Patent: ACTIVE ESTER RESIN, RESIN VARNISH, CURABLE RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR SEALING MATERIAL, COPPER-CLAD LAMINATE, INTERLAYER INSULATING MATERIAL FOR BUILD-UP SUBSTRATE, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE

GENEVA, Sept. 7 -- NIPPON KAYAKU KABUSHIKI KAISHA filed a patent application (JP2026/007046) for “ACTIVE ESTER RESIN, RESIN VARNISH, CURABLE RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR SEALING MATERIAL, COPPER-CLAD LAMINATE, INTERLAYER INSULATING MATERIAL FOR BUILD-UP SUBSTRATE, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE”. With publication no. WO/2026/182131, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C07D 209/34

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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