GENEVA, April 5 -- ACM RESEARCH (SHANGHAI) , INC. (Building 4, No.1690 Cai Lun Road, China (shanghai) Pilot Free Trade ZonePudong New Area, Shanghai 201203), 盛美半导体设备（上海）股份有限公司 (中国上海市浦东新区中国（上海）自由贸易试验区蔡伦路1690号第4幢) filed a patent application (PCT/CN2025/116840) for "SUBSTRATE CENTERING APPARATUS AND SUBSTRATE CENTERING METHOD" on Aug 26, 2025. With publication no. WO/2026/066877, the details related to the patent application was publi...
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