International Patent: ACCESSORY FOR THE ELECTRICAL WIRING OF A MODULAR WALL AND ELECTRICALLY-WIRED MODULAR WALL

GENEVA, July 18 -- HENOTO S.P.A. filed a patent application (IB2025/050369) for “ACCESSORY FOR THE ELECTRICAL WIRING OF A MODULAR WALL AND ELECTRICALLY-WIRED MODULAR WALL”. With publication no. WO/2026/150236, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H02G 3/38

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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