GENEVA, Aug. 14 -- HUSKY INJECTION MOLDING SYSTEMS LTD. filed a patent application (CA2025/051661) for “A SHEAR LAYER CONTROL DEVICE”. With publication no. WO/2026/165638, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B29C 45/27
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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