International Patent: A METHOD OF CONNECTING AT LEAST ONE ELECTRICALLY CONDUCTIVE COMPONENT TO AN AT LEAST ONE COMPOSITE METAL FOIL, AN ELECTRICALLY CONDUCTIVE COMPONENT, A COMPOSITE METAL FOIL, AND A SYSTEM FOR PROVIDING AN ELECTRICALLY CONDUCTIVE COMPONENT

GENEVA, Nov. 6 -- NEXPERIA B.V. filed a patent application (CN2025/091781) for “A METHOD OF CONNECTING AT LEAST ONE ELECTRICALLY CONDUCTIVE COMPONENT TO AN AT LEAST ONE COMPOSITE METAL FOIL, AN ELECTRICALLY CONDUCTIVE COMPONENT, A COMPOSITE METAL FOIL, AND A SYSTEM FOR PROVIDING AN ELECTRICALLY CONDUCTIVE COMPONENT”. With publication no. WO/2026/227268, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01L 23/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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