International Patent: A METHOD FOR MANUFACTURING A SEMICONDUCTOR POWER PACKAGE AS WELL AS SUCH SEMICONDUCTOR POWER PACKAGE COMPRISING AT LEAST ONE SEMICONDUCTOR DEVICE

GENEVA, Sept. 7 -- NEXPERIA B.V. filed a patent application (EP2026/055519) for “A METHOD FOR MANUFACTURING A SEMICONDUCTOR POWER PACKAGE AS WELL AS SUCH SEMICONDUCTOR POWER PACKAGE COMPRISING AT LEAST ONE SEMICONDUCTOR DEVICE”. With publication no. WO/2026/180722, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 70/04

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....