GENEVA, July 1 -- NEXPERIA B.V. filed a patent application (CN2024/138357) for “A METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS SUCH SEMICONDUCTOR PACKAGE ASSEMBLY”. With publication no. WO/2026/123232, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/60
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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