International Patent: A HEAT LIFT ASSEMBLY EMPLOYING FLOW TUBE CIRCUITS FOR THE CONTROLLED KEEPING OR CONVEYANCE OF BULK FLUIDS

GENEVA, July 9 -- GENH2 CORP filed a patent application (US2025/045192) for “A HEAT LIFT ASSEMBLY EMPLOYING FLOW TUBE CIRCUITS FOR THE CONTROLLED KEEPING OR CONVEYANCE OF BULK FLUIDS”. With publication no. WO/2026/147564, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: F28F 9/013

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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