GENEVA, July 31 -- TEMCO INDUSTRIAL, LLC filed a patent application (US2026/012041) for “A FLUID PUMP AND METHOD OF MANUFACTURING SAME”. With publication no. WO/2026/161482, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: F04D 3/02
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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